-
dgylyaoo ha inviato un aggiornamento 4 anni, 10 mesi fa
A nozzle mounted on the head of the chip for picking up component chips mounted on the board.With the miniaturization and high density of components on the circuit board, higher requirements are placed on the accuracy of the placement machine, and higher requirements are placed on the accuracy and quality of the SMT nozzle.
Reasons for poor suction of the nozzle:
(1) The vacuum negative pressure is insufficient, When the nozzle takes the component, a certain negative pressure is generated at the nozzle, and the component is adsorbed on the nozzle,determine if the nozzle pickup element is abnormal. Generally, the negative pressure detection mode is adopted, and the negative pressure is used. When the sensor detection value is within a certain range, the machine considers that the suction is normal, and vice versa.
(2) The nozzle is worn, the nozzle is deformed, blocked or damaged, resulting in insufficient air pressure, resulting in the component being unable to absorb.Therefore, it is necessary to regularly check the degree of wear of the nozzle and strictly replace it.
(3) The influence of the feeder, the feeder feeding is poor (the feeder gear is damaged), the material hole is not stuck on the feeder gear, there is foreign matter under the feeder, the spring clamp is worn, the pressure belt cover, the spring and other operating machines Deformation, rust, etc., causing the component to absorb or not absorb the device. Therefore, it should be checked regularly to deal with problems in time to avoid wasting a lot of devices.
(4) The ideal suction height is 0.05mm when the nozzle of the placement machine touches the surface of the component., if the depth of the pressing is too large, the components will be pressed into the trough and cannot be expected.If the suction condition of a component is not good, the suction height can be adjusted slightly upwards, for example, 0.05 mm.
(5) Incoming material problems, some manufacturers have the quality problems of the chip component packaging, such as the large pitch error of the perforation, the excessive adhesion between the paper tape and the plastic film, the size of the trough is too small, etc. Possible reasons why the component cannot be absorbed.Hitachi SMT Nozzle
website:http://www.trssmt.com/smt-nozzle/hitachi-smt-nozzle/